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INTEGRATED CIRCUITS
DATA SHEET
TDA8792 3.3 V, 25 MHz 8-bit analog-to-digital converter (ADC)
Product specification Supersedes data of 1995 Apr 26 File under Integrated Circuits, IC02 1996 Feb 21
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit analog-to-digital converter (ADC)
FEATURES * 8-bit resolution * Sampling rate up to 25 MHz * 30 MHz input signal bandwidth (full scale) * High signal-to-noise ratio over a large analog input frequency range (7.3 effective bits at 4.43 MHz full-scale input at fclk = 25 MHz) * CMOS compatible digital inputs * External reference voltage regulator * Power dissipation only 53 mW (typical) * Standby mode (only 1.2 mW typical) * Low analog input capacitance, no buffer amplifier required * No sample-and-hold circuit required. APPLICATIONS Analog-to-digital conversion for: * General purpose * Hand-held equipment * Mobile telecommunication * Instrumentation * Video. GENERAL DESCRIPTION
TDA8792
The TDA8792 is a 8-bit analog-to-digital converter (ADC) for low-voltage, portable applications. It operates at 3.3 V and converts the analog input signal into 8-bit binary-coded digital words at a maximum sampling rate of 25 MHz. The output data is valid after a delay of 6 clock cycles.
QUICK REFERENCE DATA SYMBOL VDDA VDDD VDDO IDDA IDDD IDDO INL DNL fclk(max) Ptot PARAMETER analog supply voltage digital supply voltage output stages supply voltage analog supply current digital supply current output stages supply current integral non-linearity differential non-linearity maximum clock frequency total power dissipation fclk = 25 MHz; CL = 15 pF; ramp input fclk = 25 MHz; CL = 15 pF; ramp input fclk = 25 MHz; ramp input fclk = 25 MHz; ramp input CONDITIONS MIN. 2.85 2.70 2.5 - - - - - 25 - TYP. 3.3 3.3 3.3 12 3 1 0.4 0.3 - 53 MAX. 3.6 3.6 3.6 20 6 2 0.8 0.75 - 100 UNIT V V V mA mA mA LSB LSB MHz mW
ORDERING INFORMATION TYPE NUMBER TDA8792M PACKAGE NAME SSOP24 DESCRIPTION plastic shrink small outline package; 24 leads; body width 5.3 mm VERSION SOT340-1
1996 Feb 21
2
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit analog-to-digital converter (ADC)
BLOCK DIAGRAM
TDA8792
ndbook, full pagewidth
STDBY 1 V DDD
24 23
CLK VSSO VDDO
2
TDA8792
22
VSSD2 3 VSSA1 VI 21 D7 20 D6 7x8 OFFSET COMPENSATED COMPARATORS DECODER LATCHES 8 19 D5 18 D4 OUTPUT BUFFER
4
MSB
5
V DDA 6 I bias 7 V RT 8 VRM 9 V RB 10
data outputs 17 D3
16 D2 REFERENCE LADDER 15 D1 DAC 14 D0 LSB
VSSA2 12
13 OE
MLD119 - 1
Fig.1 Block diagram.
1996 Feb 21
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Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit analog-to-digital converter (ADC)
PINNING SYMBOL STDBY VDDD VSSD2 VSSA1 VI VDDA Ibias VRT VRM VRB n.c. VSSA2 OE D0 D1 D2 D3 D4 D5 D6 D7 VDDO VSSO CLK PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 DESCRIPTION standby input digital supply voltage (+3.3 V) digital ground 2 analog ground 1 analog input voltage analog supply voltage (+3.3 V) bias current input reference voltage TOP input reference voltage MIDDLE reference voltage BOTTOM input not connected analog ground 2 output enable input (CMOS level input, active LOW) data output; bit 0 (LSB) data output; bit 1 data output; bit 2 data output; bit 3 data output; bit 4 data output; bit 5 data output; bit 6 data output; bit 7 (MSB) positive supply voltage for output stage (+3.3 V) output ground clock input Fig.2 Pin configuration.
V
handbook, halfpage
TDA8792
STDBY V DDD
1 2
24 CLK 23 VSSO 22 V DDO
VSSD2 3 VSSA1 VI DDA 4 5 6
21 D7 20 D6 19 D5
TDA8792
7 8 9 18 D4 17 D3 16 D2 15 D1 14 D0 13 OE
MLD120 - 1
I bias V RT V RM
V RB 10 n.c. 11 VSSA2 12
1996 Feb 21
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Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit analog-to-digital converter (ADC)
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDDA VDDD VDDO VDD1 VDD2 VDD3 VI Vclk(p-p) IO Tstg Tamb Tj Note PARAMETER analog supply voltage digital supply voltage output stages supply voltage supply voltage differences between VDD1 = VDDA - VDDD supply voltage differences between VDD2 = VDDD - VDDO supply voltage differences between VDD3 = VDDA - VDDO input voltage AC input voltage for switching (peak-to-peak value) output current storage temperature operating ambient temperature junction temperature referenced to VSSA referenced to VSSD CONDITIONS note 1 note 1 note 1 MIN. -0.5 -0.5 -0.5 -0.3 -1.0 -1.0 -0.5 - - -55 -20 -
TDA8792
MAX. +5.0 +5.0 +5.0 +0.3 +1.0 +1.0 +5.0 VDDD 10 +150 +75 +125 V V V V V V V V
UNIT
mA C C C
1. The supply voltages VDDA, VDDD and VDDO may have any value between -0.5 V and +5.0 V provided that the differences VDD1, VDD2 and VDD3 are respected. HANDLING Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. THERMAL CHARACTERISTICS SYMBOL Rth j-a PARAMETER thermal resistance from junction to ambient in free air VALUE 119 UNIT K/W
1996 Feb 21
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Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit analog-to-digital converter (ADC)
TDA8792
CHARACTERISTICS VDDA = V6 to V4,12 = 2.85 to 3.6 V; VDDD = V2 to V3 and V1 = 2.7 to 3.6 V; VDDO = V22 to V23 = 2.5 to 3.6 V; VSSA, VSSD and VSSO shorted together; VDDA to VDDD = -0.15 to +0.15 V; fclk = 25 MHz; 50% duty factor; VIL = 0 V; VIH = VDDD; CL = 15 pF; Tamb = 0 to +70 C; typical values measured at VDDA = VDDD = VDDO = 3.3 V and Tamb = 25 C; unless otherwise specified. SYMBOL Supply VDDA VDDD VDDO IDDA IDDD IDDO Inputs CLOCK INPUT CLK (REFERENCED TO VSSD); note 1 VIL VIH IIL IIH CI VIL VIH IIL IIH IIL IIH ZI CI VRB VRT Vdiff Iref RLAD TCRLAD LOW level input voltage HIGH level input voltage LOW level input current HIGH level input current input capacitance Vclk = 0.4 V Vclk = 2.7 V 0 2.0 -10 - - 0 2.0 VIL = 0.4 V VIH = 2.7 V VI = 0 V VI = 1.5 V fi = 4.43 MHz fi = 4.43 MHz -10 - -20 - - - - - - - 10 - - - - - - 35 5 - - 1.5 1.3 1250 1 0.8 VDDD - 10 - 0.8 VDDD - +10 - +20 - - V V A A pF analog supply voltage digital supply voltage output stages supply voltage analog supply current digital supply current output stages supply current CL = 15 pF; ramp input 2.85 2.7 2.5 - - - 3.3 3.3 3.3 12 3 1 3.6 3.6 3.6 20 6 2 V V V mA mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
INPUTS OE AND STDBY (REFERENCED TO VSSD); see Tables 2 and 3 LOW level input voltage HIGH level input voltage LOW level input current HIGH level input current V V A A A A k pF
VI (ANALOG INPUT VOLTAGE REFERENCED TO VSSA) LOW level input current HIGH level input current input impedance input capacitance
Reference voltages for the resistor ladder; see Table 1 reference voltage BOTTOM reference voltage TOP differential reference voltage VRT - VRB reference current resistor ladder temperature coefficient of the resistor ladder 0 1.4 1.25 - - - 0.15 1.6 1.6 - - - V V V mA /K
1996 Feb 21
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Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit analog-to-digital converter (ADC)
SYMBOL Outputs DIGITAL OUTPUTS D7 TO D0 (REFERENCED TO VSSO) VOL VOH IOZ LOW level output voltage HIGH level output voltage output current in 3-state mode IO = 1 mA IO = -1 mA 0.4 V < VO < VDDO 0 -10 - - PARAMETER CONDITIONS MIN. TYP.
TDA8792
MAX.
UNIT
0.4 VDDO +10
V V A
VDDO - 0.4 -
Switching characteristics CLOCK INPUT CLK (VDDA = 3.15 TO 3.45 V; VDDD = 3.15 TO 3.45 V); see Fig.3 and note 1 fclk(max) fclk(min) tCPH tCPL maximum clock frequency minimum clock frequency clock pulse width HIGH clock pulse width LOW 25 0.5 16 16 - - - - - - - - MHz MHz ns ns
Analog signal processing LINEARITY INL DNL integral non-linearity differential non-linearity ramp input ramp input - - 20 - 0.4 0.3 30 35 0.8 0.75 - - LSB LSB
BANDWIDTH (VDDA = 3.15 TO 3.45 V; VDDD = 3.15 TO 3.45 V); TAMB = 25 C B analog bandwidth full-scale sine wave; note 2 small signal at mid-scale; Vi = 10 LSB at code 128; note 2 tSTLH tSTHL HARMONICS h1 hall fundamental harmonics (full scale) harmonics (full scale); all components second harmonics third harmonics THD total harmonic distortion fi = 4.43 MHz without harmonics; fclk = 25 MHz; fi = 4.43 MHz SIGNAL-TO-NOISE RATIO; see Figs 6 and 11; note 4 S/N signal-to-noise ratio (full scale) - 46 - dB fi = 4.43 MHz fi = 4.43 MHz - - - -61 -61 -58 - - - dB dB dB - - 0 dB analog input settling time LOW-to-HIGH full-scale square wave; Fig.5; note 3 analog input settling time HIGH-to-LOW full-scale square wave; Fig.5; note 3 MHz MHz
- -
8 8
12 12
ns ns
1996 Feb 21
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Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit analog-to-digital converter (ADC)
SYMBOL PARAMETER CONDITIONS MIN. TYP.
TDA8792
MAX.
UNIT
EFFECTIVE BITS; see Figs 6 and 11; note 4 EB effective bits fclk = 25 MHz fi = 2.0 MHz fi = 4.43 MHz fi = 7.5 MHz fi = 10 MHz DIFFERENTIAL GAIN; see note 5 Gdiff differential gain fclk = 25 MHz; PAL modulated ramp - 1.5 - % - - - - 7.4 7.3 7.2 7.0 - - - - bits bits bits bits
DIFFERENTIAL PHASE; see note 5 diff differential phase fclk = 25 MHz; PAL modulated ramp - 0.5 - deg
Timing (fclk = 25 MHz); see Fig.3 and note 6 tds th td tdZH tdZL tdHZ tdLZ tdSTBLH tdSTBHL Notes 1. In addition to a good layout of the digital and analog ground, it is recommended that the rise and fall times of the clock must not be less than 1 ns. 2. The analog bandwidth is defined as the maximum full-scale input sine wave frequency which can be applied to the device. No glitches greater than 8 LSBs are observed in the reconstructed signal neither is there any significant attenuation. 3. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale input (square-wave signal) in order to sample the signal and obtain correct output data. 4. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8K acquisition points per equivalent fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency (NYQUIST frequency). Conversion to signal-to-noise ratio: S/N = EB x 6.02 + 1.76 dB. 5. Measurement carried out using video analyser VM700A, where the video analog signal is reconstructed through a digital-to-analog converter. 6. Output data acquisition: the output data is available after the maximum delay time of td. In the event of 25 MHz clock operation, the hardware design must be taken into account the td and th limits with respect to the input characteristics of the acquisition circuit. 7000 7. Maximum value standby mode start-up output delay time (HIGH-to-LOW transition): 100 + ------------------------ . f clk (MHz) 1996 Feb 21 8 sampling delay time output hold time output delay time - 6 8 - - - - - - - - 13 2 - 25 ns ns ns
3-state output delay times; see Fig.4 enable HIGH enable LOW disable HIGH disable LOW 17 22 20 22 - - 28 30 28 30 ns ns ns ns
Standby mode output delay times standby (LOW-to-HIGH transition) start-up (HIGH-to-LOW transition) 200 ns note 7 ns
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit analog-to-digital converter (ADC)
Table 1 STEP Underflow 0 1 . . 254 255 Overflow Table 2 Output coding and input voltage (typical values; referenced to VSSA) BINARY OUTPUT BITS VI(p-p) (V) <0 0 . . . . 1.5 >1.5 Mode selection OE 1 0 D7 TO D0 high impedance active; binary D7 0 0 0 . . 1 1 1 D6 0 0 0 . . 1 1 1 Table 3 D5 0 0 0 . . 1 1 1 D4 0 0 0 . . 1 1 1 D3 0 0 0 . . 1 1 1 D2 0 0 0 . . 1 1 1
TDA8792
D1 0 0 0 . . 1 1 1
D0 0 0 1 . . 0 1 1
Standby selection D7 TO D0 LOW active IDDA + IDDD (typ.) 0.4 mA 15 mA
STDBY 1 0
t CPL t CPH CLK 1.4 V
sample N 1
sample N 2
sample N 6
Vl
t ds DATA D0 to D7 DATA N6 DATA N5 td DATA N1
th V DDO DATA N
MLD121
0.4 V
50% 0.4 V
Fig.3 Timing diagram.
1996 Feb 21
9
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit analog-to-digital converter (ADC)
TDA8792
handbook, full pagewidth
V DDD OE 50 %
t dHZ HIGH 90 % output data t dLZ HIGH output data LOW 10 % 50 % t dZL LOW
t dZH
50 %
TEST V DDD 3.3 k TDA8792 15 pF OE S1 t dLZ t dZL t dHZ t dZH
S1 VDDD VDDD GND GND
MLD122
fOE = 100 kHz.
Fig.4 Timing diagram and test conditions of 3-state output delay time.
1996 Feb 21
10
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit analog-to-digital converter (ADC)
TDA8792
t STLH code 255 VI code 0 2 ns 50 %
t STHL
50 %
2 ns
CLK
50 %
50 %
MLD123
2 ns
2 ns
Fig.5 Analog input settling-time diagram.
MLD118
handbook, full pagewidth
0
A (dB) 20
40
60
80
100
120 0 1.56 3.13 4.69 6.25 7.82 9.38 10.9 f (MHz) Effective bits: 7.42; THD = -57.27 dB; Harmonic levels (dB): 2nd = -60.76; 3rd = -60.96; 4th = -76.17; 5th = -80.63; 6th = -66.96. 12.5
Fig.6 Typical Fast Fourier Transform (fclk = 25 MHz; fi = 4.43 MHz).
1996 Feb 21
11
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit analog-to-digital converter (ADC)
INTERNAL PIN CONFIGURATIONS
TDA8792
V DDA
D7 to D0
V
I
V
MLD124
SSA
MLD125
Fig.7 Digital data outputs.
Fig.8 Analog inputs.
handbook, halfpage handbook, halfpage
VDDA
V DDD VRT
OE, CLK or STDBY V
VRM VRB
R LAD
SSD
MLD126 - 1
VSSA
MLC859
Fig.9 Digital inputs.
Fig.10 VRB, VRM and VRT.
V DDA
I bias
V
SSA
MLD127
Fig.11 Bias current input.
1996 Feb 21
12
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit analog-to-digital converter (ADC)
APPLICATION INFORMATION
TDA8792
handbook, full pagewidth
STDBY V DDD 3.3 V VSSD2
1
24
CLK VSSO V DDO 3.3 V D7 100 nF
2
23
3 VSSA1 VI V DDA 3.3 V 100 nF 22 k 3.3 V 100 nF 100 nF V RM
(1)
22
4
21 D6 20 D5
5
6
19
I bias V RT
(1)
TDA8792
7 D4 18 D3
8
17
9 V RB 100 nF 100 nF n.c. V
(2) (1)
16
D2
10
15
D1 D0
11 SSA2 12
14 OE
13
MLD128 - 1
The analog and digital supplies should be separated and decoupled. The external voltage generator must be built such that a good supply voltage ripple rejection is achieved with respect to the LSB value. The reference ladder voltages can also be derived from a well regulated VDDA supply through a resistor bridge and a decoupled capacitor. For applications where the input signal must remain well centred around middle scale, VRM must be decoupled and connected to analog input signal (pin 5) through a resistor. The values must be defined in accordance with the input signal frequency in order to avoid direct coupling into the ADC ladder (e.g. R = 5 k and C = 100 nF). (1) VRB, VRM and VRT are decoupled to VSSA. (2) Pin 11 should be connected to VSSA in order to prevent noise influence.
Fig.12 Application diagram.
1996 Feb 21
13
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit analog-to-digital converter (ADC)
PACKAGE OUTLINE SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
TDA8792
SOT340-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 pin 1 index A1 (A 3) Lp L 1 e bp 12 wM detail X A
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.0 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 8.4 8.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 0.8 0.4 8 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT340-1 REFERENCES IEC JEDEC MO-150AG EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-09-08 95-02-04
1996 Feb 21
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Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit analog-to-digital converter (ADC)
SOLDERING SSOP Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these cases reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices.
TDA8792
If wave soldering cannot be avoided, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Even with these conditions, only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds at between 270 and 320 C.
1996 Feb 21
15
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit analog-to-digital converter (ADC)
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8792
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1996 Feb 21
16
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit analog-to-digital converter (ADC)
NOTES
TDA8792
1996 Feb 21
17
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit analog-to-digital converter (ADC)
NOTES
TDA8792
1996 Feb 21
18
Philips Semiconductors
Product specification
3.3 V, 25 MHz 8-bit analog-to-digital converter (ADC)
NOTES
TDA8792
1996 Feb 21
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Philips Semiconductors - a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. (01)60 101-1236, Fax. (01)60 101-1211 Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. (31)40-2783749, Fax. (31)40-2788399 Brazil: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SAO PAULO-SP, Brazil, P.O. Box 7383 (01064-970), Tel. (011)821-2333, Fax. (011)829-1849 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS: Tel. (800) 234-7381, Fax. (708) 296-8556 Chile: Av. Santa Maria 0760, SANTIAGO, Tel. (02)773 816, Fax. (02)777 6730 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. (852)2319 7888, Fax. (852)2319 7700 Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17, 77621 BOGOTA, Tel. (571)249 7624/(571)217 4609, Fax. (571)217 4549 Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. (45)32 88 26 36, Fax. (45)31 57 19 49 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. (358)0-615 800, Fax. (358)0-61580 920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. (01)4099 6161, Fax. (01)4099 6427 Germany: P.O. Box 10 51 40, 20035 HAMBURG, Tel. (040)23 53 60, Fax. (040)23 53 63 00 Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. (01)4894 339/4894 911, Fax. (01)4814 240 India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, Bombay 400 018 Tel. (022)4938 541, Fax. (022)4938 722 Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4, P.O. Box 4252, JAKARTA 12950, Tel. (021)5201 122, Fax. (021)5205 189 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. (01)7640 000, Fax. (01)7640 200 Italy: PHILIPS SEMICONDUCTORS S.r.l., Piazza IV Novembre 3, 20124 MILANO, Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2 -chome, Minato-ku, TOKYO 108, Tel. (03)3740 5130, Fax. (03)3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. (02)709-1412, Fax. (02)709-1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905, Tel. 9-5(800)234-7381, Fax. (708)296-8556 Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. (040)2783749, Fax. (040)2788399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. (09)849-4160, Fax. (09)849-7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. (022)74 8000, Fax. (022)74 8341 Pakistan: Philips Electrical Industries of Pakistan Ltd., Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton, KARACHI 75600, Tel. (021)587 4641-49, Fax. (021)577035/5874546 Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. (63) 2 816 6380, Fax. (63) 2 817 3474 Portugal: PHILIPS PORTUGUESA, S.A., Rua dr. Antonio Loureiro Borges 5, Arquiparque - Miraflores, Apartado 300, 2795 LINDA-A-VELHA, Tel. (01)4163160/4163333, Fax. (01)4163174/4163366 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. (65)350 2000, Fax. (65)251 6500 South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430, Johannesburg 2000, Tel. (011)470-5911, Fax. (011)470-5494 Spain: Balmes 22, 08007 BARCELONA, Tel. (03)301 6312, Fax. (03)301 42 43 Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM, Tel. (0)8-632 2000, Fax. (0)8-632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. (01)488 2211, Fax. (01)481 77 30 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978, TAIPEI 100, Tel. (886) 2 382 4443, Fax. (886) 2 382 4444 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, Bangkok 10260, THAILAND, Tel. (66) 2 745-4090, Fax. (66) 2 398-0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. (0 212)279 27 70, Fax. (0212)282 67 07 Ukraine: Philips UKRAINE, 2A Akademika Koroleva str., Office 165, 252148 KIEV, Tel. 380-44-4760297, Fax. 380-44-4766991 United Kingdom: Philips Semiconductors LTD., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. (0181)730-5000, Fax. (0181)754-8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556 Uruguay: Coronel Mora 433, MONTEVIDEO, Tel. (02)70-4044, Fax. (02)92 0601
Internet: http://www.semiconductors.philips.com/ps/ For all other countries apply to: Philips Semiconductors, International Marketing and Sales, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-2724825 SCDS47 (c) Philips Electronics N.V. 1996
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
537021/1100/02/pp20 Document order number: Date of release: 1996 Feb 21 9397 750 00675

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